Packaging

Users can send in their comments on the draft roadmap for packaging and integration as presented at the webinar on 29th May 2012. The roadmap can be downloaded here.

Cost Shared Packaging Offer

ePIXfab offers access to stanardized packaging solution from Sep 2012 for MPW chips.

To know about the design rules please view the packaging technology brochure here. This offer is compatible with ePIXfab MPW dies fabricated at imec, LETI and IHP following the design rules detailed in the brochure. Users with silicon photonic chips fabricated in other fabs can also access the technology please email This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

ePIXfab will offer 8-fiber array in and 8-fiber array out in a package such as shown below, with fibers connected to grating couplers on the silicon photonic chip with pre-defined pitch and spacings specified to the designer in the brochure above.

To obtain quotations please specify the run you would participate in and pakaging requirements to:

 

Dr. Peter O’Brien,

Photonics Packaging Group,

Tyndall National Institute,

Cork, Ireland.

Phone: 353-21-4904841

Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

 

 

As an example the package below shows- one input channel fiber and 3 output fibers.

 

Image courtesy Tyndall National Institute, Ireland

 

 

 

 

Last Updated (Tuesday, 11 September 2012 22:57)