Users can send in their comments on the draft roadmap for packaging and integration as presented at the webinar on 29th May 2012. The roadmap can be downloaded here.
Cost Shared Packaging Offer
ePIXfab offers access to stanardized packaging solution from Sep 2012 for MPW chips.
ePIXfab will offer 8-fiber array in and 8-fiber array out in a package such as shown below, with fibers connected to grating couplers on the silicon photonic chip with pre-defined pitch and spacings specified to the designer in the brochure above.
To obtain quotations please specify the run you would participate in and pakaging requirements to:
Dr. Peter O’Brien,
Photonics Packaging Group,
Tyndall National Institute,
As an example the package below shows- one input channel fiber and 3 output fibers.
Image courtesy Tyndall National Institute, Ireland
Last Updated (Tuesday, 11 September 2012 22:57)