How it works

ePIXfab's partners organize

 

  • Multi Project Wafer (MPW) shuttles in silicon photonics technologies. This allows researchers/engineers to prototype silicon photonic ICs at affordable cost.
  • Packaging, based on generic (lower-cost) solutions or more specific package design, depending on user requirements
  • Design services, from tape-out assistance to taking up your full design project
  • Training, for getting deep technology insight and hands-on design experience

 

MPW Access

User designs from around the world are grouped into masks and sent to the fabs for fabrication. In this way, mask, wafer, processing and overhead costs are all shared between the users participating in a MPW run. For the users, this fabless scheme allows them to focus on device and application ideas, design and characterization. The technologies that the ePIXfab partners offer are high-end wafer scale CMOS-type fabrication technologies. Setting up and maintaining a fab with such a complex technology is only possible for a few companies and research institutes in the world.

 

 

 

For each of the fabs, you will need to sign their Design Kit License agreement or NDA in order to obtain their Design Kit. This design kit contains technology description, design rules, verification decks, a device library, etc.

Details

Technology: IHP ePIXfab technology (SG25ESS)
NDA with IHP required
NDA available at http://dk.ihp-microelectronics.com/index1.html
Click on NDA TEMPLATE to download
Send a signed copy (scanned) to This e-mail address is being protected from spambots. You need JavaScript enabled to view it (Christine Richter), inform her about your intention to use IHP SG25ESS, include your fax number
Christine will send the login information via fax
Logon at: http://dk.ihp-microelectronics.com/index1.html
Design kit package can be downloaded
Support via: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Technology: VTT SiPhotonics Platform

To receive the PDK download the design kit license agreement (DKLA) from VTT here.
Send the signed DKLA to This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Mikko will further support the users in accessing the design kits and instructions on design submission.

Packaging Access

All access to packaging and integration solutions for 220nm SOI based technologies is handled by Tyndall Institute. Contact This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Access to packaging and integration solutions for VTT's technology is handled by VTT