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MPW and How to Access

ePIXfab organizes Multi Project Wafer (MPW) shuttles in silicon photonics technologies. This allows researchers/engineers to prototype silicon photonic ICs at affordable cost. We group user designs from around the world into masks and send it to the fabs for fabrication. In this way, mask, wafer, processing and overhead costs are all shared between the MPW run participating users. For the users, this fabless scheme allows them to focus on device and application ideas, design and characterization. The technologies that ePIXfab offers are high-end wafer scale CMOS-type fabrication technologies. Setting up and maintaining a fab with such a complex technology is only possible for a few companies and research institutes in the world. All ePIXfab fabrication is done on production-type tools.

Mature and Early access

NOTE: FOR ALL TECHNOLOGIES USERS ARE STRONGLY ENCOURAGED TO CONTACT FABS 3 MONTHS BEFORE DESIGN DEADLINE.

 

ePIXfab organizes two kind of MPW shuttle runs:

  • Access to relatively mature technology is organized in cooperation with Europractice IC service
    • Technology is fully fixed, and there is experience from multiple MPW shuttles from the previous years
    • Schedule is dependable
    • You submit a design and handle all formalities with Europractice
    • ePIXfab works closely with Europractice on design support and other technical and operational aspects
  • Early access to less mature technology is organized by fab directly
    • Whereas the basic process steps are mature enough, the integrated process flow is still maturing. We are still building up MPW experience in these technologies
    • User submits a design to and handles all formalities with fab directly
    • support provided by fab directly

a) Early MPW technologies

Technology: LETI Full Platform
Access to the above technologies is through fab directly (see contact information)
Sign ePIXfab terms of use (for ePIXfab early MPW)
Choose a technology and decide on a MPW shuttle to submit your design
Receive PDK, make your design
Submit your design before the deadline as indicated on the schedule
Follow the status of the MPW displayed on the schedule
Wait for the samples or wafers


Technology: IHP ePIXfab technology (SG25ESS)
NDA with IHP required
NDA available at http://dk.ihp-microelectronics.com/index1.html
Click on NDA TEMPLATE to download
Send a signed copy (scanned) to This e-mail address is being protected from spambots. You need JavaScript enabled to view it (Christine Richter), inform her about your intention to use IHP SG25ESS, include your fax number
Christine will send the login information via fax
Logon at: http://dk.ihp-microelectronics.com/index1.html
Design kit package can be downloaded
Support via: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

 

Technology: VTT SiPhotonics Platform

To receive the PDK download the design kit license agreement (DKLA) from VTT here.
Send the signed DKLA to This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
Mikko will further support the users in accessing the design kits and instructions on design submission.

b) Europractice MPW technologies

Technology: imec ISIPP25G, imec PSV
Access to the above technologies is through Europractice IC service
Register early with Europractice
Procedure: see Europractice IC website
Submit your design - the deadlines are indicated on the schedule
Follow the status of the MPW displayed on the schedule