PIC Technologies

ePIXfab presently offers the following technologies in MPW:

These are all 200mm wafer technologies. Through the ePIXfab offer, academic and industry researchers can prototype very advanced devices including passive, fiber I/O and novel and high-performance active devices.

if you would like to know more about the Deep UV Lithography process used for processing wafers in the CMOS photonics platform click here.