LETI Standard passive with heaters
This is LETI's key process for standardized passive silicon photonic functions.
- 200mm silicon-on-insulator wafers, 220nm crystalline Si on 2um BOX
- 193nm deep UV lithography
- WG module: 220nm full etch for waveguides, photonic crystals,...
- FC module: 70nm partial etch for grating couplers, splitters, ...
- NEW: Heater module: 600nm of top oxide with Ti/TiN heaters
- Minimum linewidth: 120nm
- Minimum pitch: 280nm
- Choice from fixed design sizes
- Delivery of at least 50 dies
There is a choice from 3 design sizes (see technology file below for further information)
- S1: 7mm x 3.6mm
- S2: 7mm x 7.6mm
- S3: 7mm x 11.0mm