Shuttle runs

ePIXfab organizes multi-project wafer shuttle run access to silicon photonic integration technologies. Currently, these are the IMEC and LETI 200mm SOI submicron technologies.

The ePIXfab shuttle runs group designs of several users together in a single fabrication run. Mask, processing and overhead costs in such a run are shared by all users. In this way, the cost per user becomes affordable for research and prototyping.

ePIXfab issues calls for participation in a cost-sharing shuttle run 3 times per year, in which each user can get one or more small designs (e.g. 4mmx6mm) prototyped.

For the fabrication of your designs by ePIXfab, Your design goes through the following steps:

  • Subscribe to an open call for participation.
  • Submit your design as GDS-II file according to the design rules. The design will be checked, and if necessary, you will be asked to modify it to meet the design rules.
  • The designs of all contributors are grouped on a single mask
  • The designs on the mask are fabricated at the core partner's facility
  • The fabricated wafers are diced
  • The diced wafers are distributed to all contributors.

Operation and terms of use

The users send in a mask design at the specified date. ePIXfab will check the files and iterate with the users for corrections if necessary. All designs are integrated in a CMOS maskset and jointly fabricated. Therefore, both mask and processing costs are shared. In the currently used scheme, each user receives a full wafer with replica's of the user's design.

Currently, fabrication is done at best effort in both technologies (IMEC, LETI). However, processes are stable and known. In addition, the user is adviced on manufacturability of designs.
The user signs an NDA with IMEC to regulate ownership of intellectual property.