The IMEC and CEA-LETI ePIXfab MPW prices are based on the cost model outlined below. To know the price, ask us for a quotation or price estimate based on your requirements!

ePIXfab currently works with a unified cost model for the imec and leti technologies. The users pay for the actual cost of the run.

The cost structure is as follows:

• Mask space: cost per mm2 mask. This consists of both the actual size of your design and a proportional part of the overhead. This overhead consists of clearance, alignment markers, metrology structures, process control structures, and unallocated space. We calculate the fraction of your used space to the total used space, and calculate the proportional cost of the overhead.
• Wafers: blank wafer cost x number of wafers required
• Processing: Processing is done on a lot of wafers: up to 23 device wafers in a box. The cost of process consists of two parts:
  • cost per lot-turn: a lotturn is a single step on a lot, regardless of how many wafers in the lot receive that processing step. The more wafers receiving the step, the smaller the cost of that step per wafer.
  • cost per lot-turn-wafer: per wafer and per step, a smal cost is added.
• Start-up and delivery: a fixed cost is charged covering the cost of mask checking and integration, wafer dicing, shipping and other small processing costs.
• Overhead: the cost of ePIXfab administration and organisation of the shuttle runs is divided over the users. It consists of a lump sum and a sum proportional to the cost without overhead (all the previous items). For European users, this cost is covered by the EC-supported PhotonFAB project.

The following table gives the currently used costs for users within ePIXnet, excluding VAT. Note that this is subject to change to reflect the actual processing costs.

• Standard 6mm wide cell, 2mm height, 1 wafer, no fibre couplers: max. 4060€
• Standard 6mm wide cell, 2mm height, 1 wafer, with fibre couplers: max. 6910€
• Half standard 12mm wide cell (12.1mmx4mm), 1 wafer: max. 5150€

These are examples. The actual cost depends on the amount of sharing. Typically, the cost will tend more towards half of this maximum cost.

• For the high-resolution masks (100nm minimum feature size), we use reticles of around 20k€. For structures that need less resolution such as some grating couplers and various windows, lower resolution masks are used, of 5-6k€. It is clear that it is only through efficient cost sharing we can obtain low mask cost.
• You do not need to pay for use of already available masks, such as for fibre couplers or your own earlier designed masks.
• Of course, we make sure that we organize the full processing run as cost-effective as possible. Generally, the more users, the more cost-effective the run is per wafer, and the smaller the cost for you.
• Because we organize the run as cost-effective as possible, we only know after mask integration and possibly even after making test lithographies, what the actual cost will be. Therefore, we give you a price bracket at the time of sign-up to the call.