New process modules were added in LETI:

• Implant and anneal
• Si and Ge epitaxy in full sheet or in cavity
• Metal deposition and etch for contacts

They were added in a flexible way so the users still have a lot of freedom to compose their desired process flow and define process parameters.

During 2008-2009 PhotonFAB has professionalized the service and made several improvements to the operation and logistics framework:

• New Terms of Use were setup for the user to sign. Now only a single document needs to be signed with IMEC. A new collaboration agreement between IMEC and CEA handles the relationship between both partners.
• Design registration and submission procedures were improved and standard documents are provided
• The design allocation scheme for IMEC has been simplified as well as the price model. The user now knows the final price upfront.

The (common) concept of a process design kit was introduced in ePIXfab. A process design kit consisting of design rules, guidelines, technology settings for layout software, a design rule deck, template masks, predefined masks and a small example library was distributed for the first time. The users gain access to the PDK after signing the Terms of Use.

A training scheme was set up, with the first of a yearly training series held 12-14 October 2009. If there is a sufficient critical mass, dedicated training sessions on location can be discussed.

Also, a tutorial on silicon photonics was made and given for the first time during the MNE 2009 conference. Can be repeated on request.

PhotonFAB has set up an Expert Group to give input for the roadmap. Sign-up to the Expert Group is free and can be done while signing in to the Interest Group

PhotonFAB also set up an Advisory Board to support the project on longer term strategy.