Like individual groups, consortia of groups can use the ePIXfab service and benefit from reduced costs through PhotonFAB. Several European, national and regionaly funded R&D projects already fabricate base circuits through ePIXfab.

 

Why would you want to use ePIXfab instead of doing it yourself?

• Often, the silicon photonic fabrication processes are not the innovating aspect of your project. Rather, the theory, simulation, circuit design, post-processing techniques or application is where your innovation is and where you want to spend the budget.
• It's cheaper for large circuits or many devices! E-beam is faster and cheaper for a couple of devices, but cannot easily handle a large field with acceptable cost and time. ePIXfab offers you a large field size, at the expense of a bigger design effort and a longer waiting time. PhotonFAB is going to decrease the design effort!
• IMEC and LETI have high-end waferscale technology* that is nowhere else available for R&D in the world. We fabricate with real CMOS tools in a 200mm pilot line.
• CMOS technology is the only technology that can handle the level of complexity that is needed once you need passive and active devices and interconnects.
• You can step from ePIXfab to a complementary service provider for post-processing, finestructuring or packaging.

*e.g. 193nm deep UV lithography

 

How?

• The normal procedure is for ePIXfab to act as a subcontractor. Depending on the funding agency/source the implementation details and financial rules differ. In practice this means listing IMEC as a subcontractor, as IMEC will be sending the invoices.
• If you need specific process development on top of the platform processes available through ePIXfab, talk to IMEC or LETI to see how there is a mutual interest.