This webinar provides an introduction to PHIX and industrial-scale photonic assembly and packaging. We cover the fundamentals of photonics packaging, including key design rules and the principles of design for manufacturability. Participants will learn how early design choices influence yield, performance, and cost, and will gain practical insights into best practices that ensure smooth transition from prototype to scalable production.
This webinar is the first of three webinars about packaging technologies for photonics. You can find the other webinars in our upcoming events page.
Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.