This final webinar on packaging technologies for photonics focuses on advanced packaging challenges and solutions. Topics include establishing reliable electrical connections, integrating high-power optical interfaces, and techniques for free-space optical packaging. We conclude with design considerations for space-grade photonic systems, addressing environmental constraints and reliability requirements. This session is ideal for designers working on demanding applications requiring high performance and long-term stability.
This webinar is the third of three webinars about packaging technologies for photonics.
Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.